Submit QuoteMiller-Stephenson offers a diverse line of EPON Epoxy Resins, EPIREZ Waterborne Resins, EPIKURE Curing Agents, and HELOXY Modifiers. These products vary in chemical structure, molecular weight, viscosity and functionality, providing the formulator with a multitude of options. There is at least one resin system that can be used to achieve a specific property or a combination of properties, whether it be low viscosity, chemical resistance, reactivity, flexibility, heat resistance, UV resistance or fire retardance.
Westlake epoxy resins give you mechanical strength, heat resistance, fire retardance, chemical and corrosion resistance, low moisture absorption, high elongation and more. Westlake epoxy resins play an integral and important role across a wide variety of applications from coatings and electrical laminates to composites and adhesives. Westlake epoxy resins, curing agents and modifiers are found in everything from cars and trucks to windmills, electronics, aircraft and buildings. They adhere, protect, bind, bond and coat and provide an expansive range of applications and capabilities, you’re sure to find an epoxy system to fit your specific formulation needs.
Epoxy Resin Blends
EPON 8132
EPON™ Resin 8132 is a 100% reactive low viscosity liquid bisphenol-A based epoxy resin diluted with an Alkyl glycidyl ether. This resin is specially designed for applications requiring low viscosity, minimum odor and good color. Benefits Include:
- Low viscosity liquid bisphenol-A based epoxy resin
- Can be cured or cross-linked with a variety of curing agents
- 100% Reactive
- Minimum Odor
Epoxy Resin Blends
EPON 815C
EPON Resin 815C is a low viscosity liquid bisphenol A based epoxy resin containing a commercial grade of n-butyl glycidyl ether. EPON Resin 815C is functionally equivalent to EPON Resin 815, and is suitable as a replacement for EPON Resin 815 in most applications. Benefits include:
- Low viscosity, allows for easy pumping and wetting of pigments and fillers
- 100% reactive. Reacts with a full range of curing agents
- Provides minimal reduction of performance properties
Unmodified Liquid Epoxy Resins
EPON 825
EPON™ Resin 825 is a high purity bisphenol A epichlorohydrin liquid epoxy. As a result, the viscosity of this product is lower than standard bisphenol A liquid resins without the use of diluents or modifiers. Resin/curing agent systems based on EPON™ 825 have greater clarity, chemical resistance, higher heat distortion temperature, and lower electrical conductivity than can be obtained with most other standard resins. Benefits include:
- Low viscosity, Low color
- Reacts with a full range of curing agents
- Produces high-strength cured systems resistant to chemical attack
Unmodified Liquid Epoxy Resins
EPON 826
EPON™ Resin 826 is a low viscosity, light colored liquid bisphenol A based epoxy resin. It finds use in a variety of applications (coatings and composites) when crosslinked or hardened with appropriate curing agents. Benefits include:
- Low viscosity, Low color
- Low ionic contamination
- Reacts with a full range of curing agents
- Produces high-strength cured systems resistant to chemical attack
Unmodified Liquid Epoxy Resins
EPON 828
EPON™ Resin 828 is an undiluted clear difunctional bisphenol A/epichlorohydrin derived liquid epoxy resin. When cross-linked or hardened with appropriate curing agents, very good mechanical, adhesive, dielectric and chemical resistance properties are obtained. Because of this versatility, EPON Resin 828 has become a standard epoxy resin used in formulation, fabrication and fusion technology. Benefits include:
- Highly versatile resin
- High solids/low VOC maintenance and marine coatings
- Very good mechanical, adhesive, dielectric and chemical resistance
Modified Liquid Epoxy Resins
EPON 8280
EPON™ Resin 8280 has been designed especially for formulating filled compounds for a wide variety of structural applications, including bonding, electrical encapsulating, tooling, flooring and most construction uses. EPON Resin 8280 is a low molecular weight resin with outstanding resistance to pigment and filler settling, which gives greater stability to filled systems. EPON Resin 8280 has superior resistance to foaming under vacuum and has an adjusted, controlled reactivity with amine curing agents, which serves to extend pot Iife and working life characteristics. In addition, viscosity stability —often a problem in anti-settling resins — presents no problem for EPON Resin 8280. Benefits include:
- Low foaming
- High resistance to filler settling
- Controlled reactivity with amine curing agents
Modified Liquid Epoxy Resins
EPON 8281
EPON™ Resin 8281 was developed for use in formulating highly filled compounds, particularly those with high levels of silica-type fillers. This resin allows the formulator to compound materials suitable for use in a wide variety of products, including adhesives, electrical encapsulants and molding compounds, tooling compounds, and most construction end uses. Benefits include:
- Excellent resistance to pigment and filler settling
- Low saponifiable chlorine level
- Superior resistance to foaming under vacuum
- Viscosity stability comparable to other conventional liquid EPON Resins
Unmodified Liquid Epoxy Resins
EPON 830
EPON™ Resin 830 is a slightly higher molecular weight BPA liquid epoxy as compared to EPON 828. The resin itself is resistant to crystallization and also in blends with HELOXY™ Modifiers. EPON Resin 830 is somewhat higher in viscosity than EPON Resin 828, although the viscosity is still easily handled. It provides greater reactivity when combined with most curing agents. Benefits include:
- Industrial floor toppings and grouting
- High build glaze, sealer or gel coats
- General purpose casting and encapsulation
- Base resin for dilution with Heloxy Modifiers
Unmodified Liquid Epoxy Resins
EPON 834
EPON™ Resin 834 is a BPA based epoxy resin that is semi-solid at room temperature. Systems using EPON Resin 834 can be formulated to be useful in a variety of high solids and tar modified coatings, high toughness adhesives, laminating, and prepreg molding materials. Because of its higher molecular weight, EPON Resin 834 provides enhanced system reactivity, surface tack and cured resin toughness in comparison to liquid grade BPA epoxies, but reduces elevated temperature performance. Ideally useful in applications requiring extra surface tack, cure speed or toughness but cannot tolerate additives or modifiers. Benefits include:
- May be blended with other epoxy resins.
- Semi-solid at room temperature, pourable at slightly elevated temperatures.
- May be used to produce 10 to 15 mil films with high adhesion.
- Improved toughness, tack and cure speed over unmodified liquid epoxies
Unmodified Liquid Epoxy Resins
EPON 862
EPON™ Resin 862 (Diglycidyl Ether of Bisphenol F) is a low viscosity, liquid epoxy resin manufactured from epichlorohydrin and Bisphenol-F. This resin contains no diluents or modifiers. EPON Resin 862 may be used as the sole epoxy resin or combined with other resins such as EPON Resin 828. When blended with EPON Resin 828, EPON Resin 862 provides a technique to reduce viscosity with no sacrifice in chemical and solvent resistance properties, and the blended resin will exhibit improved crystallization resistance properties when compared to the neat, liquid, Bisphenol-A or Bisphenol-F type resins. When EPON Resin 862 is cross-linked with appropriate curing agents, superior mechanical, adhesive, electrical and chemical resistance properties can be obtained. Benefits include:
- Low viscosity, Low color
- Reacts with a full range of epoxy curatives
- Good chemical resistance
- Superior physical properties vs. diluted (6 Poise) resins
Modified Liquid Epoxy Resins
EPON 872
EPON™ Resin 872 is a chemically modified BPA based epoxy resin that is semi-solid at room temperature. Systems using EPON Resin 872 can be formulated with other EPON Resins, HELOXY™ Modifiers, or used as the sole resin to provide varying degrees of flexibility and toughness. EPON Resin 872 is especially useful in applications requiring extra resistance to thermal shock or impacts. Benefits include:
- May be blended with other epoxy resins
- Semi-solid at room temperature, pourable at mildly elevated temperatures
- May be used to produce potting and encapsulants of high thermal shock resistance
- Improved toughness and flexibility over unmodified liquid epoxies
Epoxy Novolac Resins
EPON SU-8
EPON™ Resin SU-8 is a polymeric solid epoxy novolac resin possessing an average epoxide group functionality around eight. EPON SU-8 is compatible with bisphenol A-based epoxy resins, imparting improved high temperature strength, thermal stability, reactivity and chemical resistance. Prepreg laminates and graphite or boron reinforced composites with EPON SU-8 attain the maximum strength retention and thermal stability possible for an epoxy matrix system at elevated temperatures. Epoxy molding powders prepared with EPON SU-8 are characterized by an outstanding combination of flow stability and short press cycles. Benefits include:
- Long shelf life
- Micropulverized at ambient temperatures
- Rapid development of hot hardness
- Maximum elevated temperature strength retention
- Improved tack qualities and lateral cohesiveness of unidirectional tapes
MS Epoxy Systems
Epoxy Adhesives EpoxSys™ 300 Series
Miller-Stephenson’s line of epoxy adhesives are made up of a polymer and a hardener, that when mixed together form an incredibly strong and durable bond that adheres to a wide range of surfaces. Epoxy adhesives are commonly used as industrial adhesives as well as adaptive structural adhesives. Their ability to create a strong, temperature and [...]
MS Epoxy Systems
Epoxy Coating | EpoxSys™ 200 Series
Epoxsys 200 series are high-grade coating epoxies providing numerous advantages applicable to many different industries. Benefits include
- Odorless
- Primerless
- 100% solids and thixotropic
- Low curing heat
MS Epoxy Systems
Epoxy Filtration | EpoxSys 700 Series
The 700 series line of epoxy products from Miller-Stephenson feature highly modifiable properties that can adapt to meet any specification for your industrial filtration system. Benefits include:
- Maintain adhesion and bonding in high-temps
MS Epoxy Systems
Epoxy Potting | Epoxsys™ 400 Series
The Epoxsys™ 400 Series Potting Epoxies offers an array of finished epoxy potting solutions for multiple industrial applications. This family of potting epoxies offers a variety of products that can satisfy many physical properties needed for your application, such as
- Automotive sensor potting and encapsulations
- Electrical and Circuit board protection for utilities
- Deep-sea telecommunication cable
- PCB protection in commercial transportation
- Industrial Magnets
- Metal detectors
- Transformers
- Internal controls for lighting
Epoxy Adhesive Kit
Epoxy Resin Kit | MS-907 XPlus
$24.10
MS-907 XPlus is a multi-purpose epoxy bond and repair adhesive. It’s specially formulated, non-sag property is ideal for bonding most materials, such as metal, glass, ceramics, plastics, wood, rubber, and concrete. MS-907 XPlus is a two-part, equal volume, room temperature curing system. Benefits Include:
- Fast set-up time
- Room Temperature Curing System
- Perfect for in-plant and field use
- Useful Temperature Range (40°F/4°C to 110°F/43°C)
Epoxy Stripping Agent
Epoxy Stripper | ShieldSys™ ES1
Price range: $145.00 through $195.52
ShieldSys™ ES1 Epoxy Stripper is a powerful, industrial strength cleaner and stripper, formulated for removal of all epoxies, urethanes, enamels and paints. Effectively removes most coatings in less than 1 hour. 100% Methylene Chloride and Chlorinated solvent free.
- Industrial Strength Stripping of Epoxies, Enamels, Urethanes, and other Coatings
- Methylene Chloride and Chlorinated Solvent Free
- Soften and Removes the most stubborn coatings at room temperature, no heating required
- Low Odor and Volatility
- Direct replacement for MS-111
Poly-functional Glycidyl Ethers
HELOXY 107
HELOXY™ Modifier 107 is the diglycidyl ether of cyclohexane dimethanol. While it is primarily used as a reactive diluent or viscosity reducing modifier for epoxy resin formulations, it also can effectively serve as a reactive intermediate for further synthesis of various cycloaliphatic based resins. Benefits include:
- Reduces viscosity of epoxy formulations while maintaining most cured state properties
- Provides excellent cured state resistance to creep or deformation under high stress
- Effective means of incorporating a cycloaliphatic structure into the polymer chain
Poly-functional Glycidyl Ethers
HELOXY 48
HELOXY™ Modifier 48 is a low viscosity aliphatic triglycidyl ether useful in the viscosity, reactivity, and performance modification of epoxy resin systems. Applications can be fast setting adhesives, Low temperature curing floor surfacing and concrete patching compounds, hard abrasion resistant clear castings and decoupage systems. Benefits include:
- Reduces viscosity but retains reactivity of conventional and polyfunctional epoxy resins
- Imparts hardness and toughness to epoxy systems cured with low functionality curing agents
- Improves solubility/compatibility characteristics of highly aromatic epoxy resins without reducing functionality
Mono-functional Aliphatic Glycidyl Ethers
HELOXY 61
HELOXY™ Modifier 61 is a commercial grade butyl glycidyl ether. A low viscosity, virtually colorless monoepoxide, it is widely used in the viscosity reducing modification of epoxy resin formulations. The relatively low molecular weight of HELOXY 61 makes it the most efficient common monoepoxide in reducing the viscosity of basic epoxy resin formulations. Benefits include:
- Most efficient epoxy resin viscosity reduction of all common epoxy functional modifiers
- Outstanding substrate and filler wetting characteristics
- Excellent retention of physical strength and thermal properties of base formulations
Mono-functional Aromatic Glycidyl Ethers
HELOXY 62
HELOXY™ 62 is a commercial grade of o-cresyl glycidyl ether. A low viscosity aromatic monoepoxide, its primary use is the viscosity reduction of conventional epoxy resin systems. Benefits include:
- Reduces viscosity of higher molecular weight aromatic epoxy resins
- Excellent retention of mechanical and chemical resistance cured state properties relative to othermonoepoxides
- Low volatility
- Improves substrate and filler wetting of conventional formulations
Poly-functional Glycidyl Ethers
HELOXY 68
HELOXY™ Modifier 68 is a diglycidyl ether of neopentyl glycol and is primarily used as a reactive diluent or viscosity reducing modifier for all classes of epoxy resins. Benefits include:
- Reduces viscosity while maintaining most cured state properties
- Improves wetting characteristics
- Facilitates air release
HELOXY™ Flexibilizers
HELOXY 71
HELOXY™ Modifier 71 is an undiluted amber colored, low-viscosity liquid, aliphatic epoxy ester resin that imparts increased flexibility and resistance to thermal shock when blended with conventional liquid bisphenol A based epoxy resins. Benefits include:
- A low-viscosity flexibilizer that serves as a viscosity depressing agent
- A product that improves impact strength and toughness to a conventional liquid bisphenol A epoxy resin