HELOXY 61 | Hexion Modifier
Commercial Grade Butyl Glycidyl Ether, Outstanding Substrate And Filler Wetting Characteristics
HELOXY 61 is a commercial grade butyl glycidyl ether. A low viscosity, virtually colorless monoepoxide, it is widely used in the viscosity reducing modification of epoxy resin formulations.
Most efficient epoxy resin viscosity reduction of all common epoxy functional modifiers
Outstanding substrate and filler wetting characteristics
Excellent retention of physical strength and thermal properties of base formulations
|Weight per Epoxide||g/eq||145-155|
|Viscosity at 25°C||cP||1-2|
The relatively low molecular weight of HELOXY 61 makes it the most efficient common monoepoxide in reducing the viscosity of basic epoxy resin formulations. As with any monoepoxide, modification of basic epoxy resins with HELOXY 61 reduces the average functionality of the mixture thereby lowering overall cured state performance. However, due to its excellent viscosity reduction characteristics, relatively low levels of HELOXYModifiers are normally needed to attain desired viscosity reductions and these compromises in performance properties are held to a minimum. In any application, the amount of HELOXY 61 used in the formulation should be limited to that necessary to yield the required viscosity reduction. The maximum recommended quantity of this Epoxy Functional Modifier is about 20 percent by weight of the resin portion.
This Epoxy Resin Modifier is compatible with other epoxy resins in all proportions and is easily blended with liquid resins at room temperature. If preferred, a pre-blend of HELOXY 61 and a standard bisphenol A based liquid epoxy resin at a viscosity selected for easy handling is available as EPON™ Resin 815C. For information on properties and suggested uses of this resin, please consult the appropriate product literature.
Curing agents that are recommended for unmodified basic liquid epoxy resins can also be used with compositions containing HELOXY 61. When calculating the proper stoichiometric amount of curing agent to be used with HELOXY 61 modified resins, differences in epoxy content of the resin resulting from this modification are small and can generally be ignored at modification levels below 10 parts per hundred resin (phr).
Unless excessive amounts of HELOXY 61 are used, the physical properties of the cured systems are not seriously affected at room temperature. However, physical and electrical properties at elevated temperatures may be reduced considerably
Available in quart, gallon, 5 gallon, and 55 gallon drum sizes.
The recommendation made here with and the information set forth with respect to the performance or use of our products are believed, but not warranted to be accurate. The products discussed are sold without warranty, as to fitness or performance, express or implied and upon condition that purchasers shall make their own test to determine suitability of such products for their particular purposes. Likewise, statements concerning the possible uses of our products are not intended as recommendations to use our products in the infringement of any patent.