High-Temperature Mold Release | ReleaSys™ HTF

ReleaSys™ HTF is a highly advanced, water-based release agent designed to exhibit exceptional release of all substrates from room temperature up to 750° F. This product develops a highly lubricious and dry film on the mold surface, offering extended reapplication intervals and no costly transfer. Designed to meet the demands of the advanced composite and elastomer manufacturing industries, this high temperature mold release utilizes sophisticated fluoropolymer technology.

  • Exceptional Lubricity and Ease of Release
  • Ideal for Advanced Composites and Elastomers
  • Heat Stable to 750 ° F
  • Numerous Releases per Application
  • Water-based; No VOC; no odor