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EPON 825 Resin
High Purity Bisphenol A Epichlorohydrin Epoxy Resin, Reacts With a Full Range of Curing Agents
EPON 825 is a high purity bisphenol A epichlorohydrin liquid epoxy. As a result, the viscosity of this product is lower than standard bisphenol Aliquid resins without the use of diluents or modifiers. Resin/curing agent systems based on EPON™ 825 have greater clarity, chemical resistance, higher heat distortion temperature, and lower electrical conductivity than can be obtained with most other standard resins. Due to the high purity, the resin may form crystals. The crystals can be converted to liquid without damaging the resin by opening the drum bung and heating between 45 °C (113 °F) and 50 °C (122 °F). The tendency to crystallize can also be reduced by adding either 5% to 10% of para-tertiary-butyl phenol glycidyl ether or 20% to 30% of EPON™ Resin 862, a bisphenol F (BPF) epoxy resin.
EPON 825 Application Areas/Suggested Uses
- Blend with high performance multifunctional epoxy resins to reduce viscosity
- Electrical castings and encapsulations
- Low volatile organic compound (VOC) coatings
- Aerospace and specialty adhesives
- Specialized tooling
EPON 825 Benefits
- Low viscosity
- Low color
- Reacts with a full range of curing agents
- Produces high-strength cured systems resistant to chemical attack
EPON 825 General Information
With EPON™ 825 Resin you get the convenience of a low viscosity resin without the presence of a diluent which can lower performance properties of cured systems. Also, you get better performance from cured systems than can be obtained using similar resins which are less pure and higher in viscosity. EPON™ Resin 825 has these benefits because, unlike other resins, it is composed mainly of a single molecular structure. In general you can expect to obtain castings with EPON™ Resin 825 which have high heat distortion temperature. The low color of EPON™ Resin 825 will produce low color castings suitable for such optically demanding applications as LEDs and LCDs. The low viscosity permits degassing at high vacuum even at elevated temperatures to avoid bubble formation in the final product. EPON™ 825 can be used with all of the curing agents common to EPON 828 systems. This provides a full range of curing temperatures, pot life and handling characteristics to choose from.
Sales Specification
| Property | Units | Value | Test Method/Standard |
| Weight per Epoxide | g/eq | 175 – 180 | ASTM D1652 |
| Viscosity at 25°C | P | 50 – 65 | ASTM D445 |
| Color | Gardner | 1 max. | ASTM D1544 |
Typical Properties
| Property | Units | Value | Test Method/Standard |
| Density at 25°C | lb/gal | 9.7 – 9.8 | ASTM D1475 |
| Saponifiable chloride | % wt. | 0.03 max. | |
| Sodium 1 | ppm | 2 max. |
Miller-Stephenson is an Epon 825 Supplier and certified from Hexion for direct distribution, technical support, and formulation modifications. For Technical Service Question please click here
Krytox™ is a trademark of The Chemours Company FC, LLC.
The recommendation made here with and the information set forth with respect to the performance or use of our products are believed, but not warranted to be accurate. The products discussed are sold without warranty, as to fitness or performance, express or implied and upon condition that purchasers shall make their own test to determine suitability of such products for their particular purposes. Likewise, statements concerning the possible uses of our products are not intended as recommendations to use our products in the infringement of any patent.