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EPON 164
Solid Multifunctional Epichlorohydrin/Cresol Novolac Epoxy Resin
Product Description EPON 164 is a solid multifunctional epichlorohydrin/cresol novolac epoxy resin (see molecular structure). It combines the high thermal stability of the novolac backbone with the versatility, reactivity, and chemical resistance of epoxy resins. EPON 164 is used where improved properties of cured epoxy resin systems are needed, particularly at elevated temperature and where stability of electrical properties under humid conditions are required. EPON 164 finds application in electrical laminates, molding compounds, high performance aerospace composites, high temperature adhesives, powder coatings, and tooling.
Benefits
- An average of five reactive epoxide groups per molecule
- Low ionic contaminants
- Low saponifiable chloride
- Easily ground into uniform particle size
- Low melt viscosity
- Stability on storage
EPON 164 Benefits
The use of EPON Resin 164 in epoxy resin formulations increases resistance to attack by moisture, solvents, and environment. In addition, it brings higher glass transition temperature (Tg) and crosslink density to cured systems which provides improved retention of strength, rigidity, electrical, and other properties at elevated temperatures. EPON Resin 164 is commonly used in formulations for making structural laminates, electrical printed circuit boards, and electronic molding powders which require higher performance temperatures and greater dimensional stability. EPON Resin 164 is easily ground into powders or blended with other epoxy resins. It is compatible with most materials used with BPA-based epoxies and its low melt viscosity provides ease of handling and good flow characteristics. Its low ionic contamination plus ultra low saponifiable chloride reduces the potential of device failure in sensitive electronic devices. Because of this, EPON Resin 164 is the resin of choice for transfer molding compounds in semi-conductors, relays or other active or passive components in the electronic field. The high functionality of EPON Resin 164 shortens cure times and improves handling and speed of production. The resin has excellent adhesive properties needed for bonding both metal and non-metal structural components. Typically, it maintains low weight loss in heat aging of cured systems. For these reasons, EPON Resin 164 is preferred for high temperature adhesives, structural composites, and other high performance products in the aircraft and aerospace industry. Because most cured resin systems retain a significant proportion of properties up to their glass transition temperature (Tg), frequently the needed performance properties can be predicted based upon the Tg for the system selected. Hence, this bulletin provides a large amount of glass transition temperature data on a variety of systems to provide the reader with starting point compositions plus a guide for optimizing these systems.
EPON 164 Sales Specification
| Property | Units | Value | Test Method/Standard |
| Weight per Epoxide | g/eq | 200 – 240 | ASTM D1652 |
| Viscosity at 25°C | cP | 35 – 50 | ASTM D445 |
| Color | Gardner | 6 max. | ASTM D1544 |
60% weight solution in MEK
Typical Properties
| Property | Units | Value | Test Method/Standard |
| Melt Viscosity at 150°C | cSt | 600 – 1200 | ASTM D445, CannonFenske |
| Flash Point, Setaflash | °F | >200 | ASTM D3278 |
| Melting Point, at 1°C/min | °C | 82 | ASTM D3461 |
Miller-Stephenson is an Epon 164 Supplier and certified from Hexion for direct distribution, technical support, and formulation modifications. For Technical Service Question please click here
Krytox™ is a trademark of The Chemours Company FC, LLC.
The recommendation made here with and the information set forth with respect to the performance or use of our products are believed, but not warranted to be accurate. The products discussed are sold without warranty, as to fitness or performance, express or implied and upon condition that purchasers shall make their own test to determine suitability of such products for their particular purposes. Likewise, statements concerning the possible uses of our products are not intended as recommendations to use our products in the infringement of any patent.