EPON™ Resin 1002F is a solid epoxy resin derived from a liquid epoxy resin and bisphenol-A. This epoxy resin finds application in solution type coatings, as an intermediate in the preparation of epoxy esters, high performance hot melt adhesives, molding powders, and in powder coatings. Benefits include:
Can be formulated into high performance amine or polyamide cured coatings.
Exhibits unique melt viscosity for hot melt adhesives.
Displays a desirable reactivity, rheology and electrical properties in powder coatings.
This resin will not “block” or sinter even at slightly elevated storage temperatures.
Filtered during manufacture so final product is very clean.
The recommendation made here with and the information set forth with respect to the performance or use of our products are believed, but not warranted to be accurate. The products discussed are sold without warranty, as to fitness or performance, express or implied and upon condition that purchasers shall make their own test to determine suitability of such products for their particular purposes. Likewise, statements concerning the possible uses of our products are not intended as recommendations to use our products in the infringement of any patent.