EPIKURE™ Curing Agent W system consists of a bisphenol-F epoxy resin and an aromatic amine for fabricating composite parts using resin transfer molding (RTM) or filament winding. EPIKURE Curing Agent W has low viscosity and very long working life at room temperature making this system versatile and easy to process and does not contain methylene dianiline (MDA). Benefits include:

    • Low room temperature viscosity (about 2200 cP)
    • Long working life (>20 hrs.)
    • Low moisture absorption (2-2.5 wt%)
    • Good epoxy performance characteristics
    • Non-MDA aromatic amine, High elongation
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