EPIKURE W | Hexion Curing Agent
Low Viscosity And Very Long Working Life At Room Temperature, Aromatic Amine Curing Agent System Consists Of a Bisphenol-F Epoxy Resin
The EPIKOTE™ Resin 862/ EPIKURE W Aromatic Amine Curing Agent system consists of a bisphenol-F epoxy resin and an aromatic amine for fabricating composite parts using resin transfer molding (RTM) or filament winding. EPIKURE W does not contain methylene dianiline (MDA) but is an Aromatic Amine Curing Agent which has low viscosity and very long working life at room temperature making this system versatile and easy to process. EPIKURE Curing Agent 537 may be utilized to decrease the gel time of the system with little or no effect on mechanical properties.
Application Areas/Suggested Uses
- For advanced composite structures
- Resin transfer molding (RTM)
- Filament winding
- Low room temperature viscosity (about 2200 cP)
- Long working life (>20 hrs.
- Low moisture absorption (2-2.5 wt%)
- Good epoxy performance characteristics
- Non-MDA aromatic amine
- High elongation
Composite Fabrication- Resin Transfer Molding RTM
The low viscosity feature of the EPIKOTE Resin 862 / EPIKURE W Curing Agent resin system permits low injection pressures, less fiber washout, high filler/fiber loading, and lower mold costs for RTM fabrication processes. An ambient temperature, one-pot, RTM process may be employed in which the mixed resin/curing agent increases from 2200 cP initially to 5000 cP after about 36 hours. Alternatively, a two-pot resin and curing agent system can be used in which either the resin or both pots may be heated, generally less then 60 °C (140 °F) unless otherwise required. A typical process includes injecting into a heated mold at 121 °C (250 °F). The system viscosity at this temperature is on the order of 10 cP. Following the resin injection, the system should be cured in the mold for between 0.5-1.5 hours at 177 °C (350 °F) followed by a 177 °C (350 °F) post-cure for another hour. Molding and postcure temperatures and times can be modified for optimum production.
Composite Fabrication — Filament Winding
The low viscosity and long room temperature pot life of the EPIKOTE Resin 862 / EPIKURE W Curing Agent resin system make it suitable for use in wet filament winding applications.The material may be used at room temperature or heated to reduce viscosity and facilitate fiber wet out. The initial mixed system viscosity of 2200 cP may be reduced to approximately 1000 cP by heating the system to about 40 °C (100 °F). The pot life at this temperature is in excess of 8 hours, sufficient for winding large or complex parts. EPIKOTE Resin 862/EPIKURE Curing Agent W is suitable for use with glass, carbon, and aramid reinforcements. If air entrapment during mixing or fiber impregnation proves to be a problem, air release agents, such as BYK™ A-501* or equivalent, may be added. Cure may be conducted through internal heat sources in the mandrel or externally with ovens or both. Additional resin/reinforcement compaction may be accomplished during cure using traditional vacuum and pressure techniques. Frequently, a staged cure is most desirable in order to minimize resin runout and void formation in the composite. If
shrink wrap, vacuum bagging, or other external containment is not utilized, it is recommended that the part be rotated during cure to ensure uniform resin distribution through the part. A suggested cure cycle would include 1 hour at 121 °C (250 °F) plus 2.5 hours at 177 °C (350 °F).
Available in quart, gallon, 5 gallon, and 55 gallon drum sizes.
The recommendation made here with and the information set forth with respect to the performance or use of our products are believed, but not warranted to be accurate. The products discussed are sold without warranty, as to fitness or performance, express or implied and upon condition that purchasers shall make their own test to determine suitability of such products for their particular purposes. Likewise, statements concerning the possible uses of our products are not intended as recommendations to use our products in the infringement of any patent.