EPIKURE 3055

EPIKURE 3055 | Hexion Curing Agent

An Aliphatic Amidoamine, Considered For Room Temperature Curing Applications, Versatility and Convenient Working Characteristics

EPIKURE 3055 is an aliphatic amidoamine. Due to its versatility and convenient working characteristics, it should be considered for room temperature curing applications for epoxy resins and in many applications where elevated temperature curing cycles can be used. When EPIKURE 3055 is used as the sole crosslinker, the combining ratio with an epoxy resin can be varied to obtain a wide range of properties. It may also be used in conjunction with other curing agents to vary properties or curing rates. EPIKURE Curing Agent 3055 is usually recommended for use with EPON™ Resin 828 at a ratio of 50 parts per 100 parts of resin, but it can be used within a range of 40 to 100 parts per 100 parts of resin, depending on the desired properties of the cured product. Increasing the amount of EPIKURE 3055 improves toughness and flexibility at the expense of tensile strength, moisture resistance and electrical properties particularly at elevated temperatures. For applications requiring very low viscosity, a part or all of the EPON 828 can be replaced with a reactive diluent such as HELOXY™ Modifier 61. Substitution is accompanied by some change in the properties of the cured resin. As with all room temperature curing epoxy resin systems, the gel time and exothermic temperature rise for an epoxy resin composition containing EPIKURE Curing Agent 3055 depend on the size of the batch, the amount and type of filler loading, the ratio of resin to curing agent and the mixing temperature. Cure time at room temperature depends to a large extent on the exothermic temperature rise. In thin sections where exothermic heat is readily dissipated, an overnight cure is required for the composition to reach handling strength and full cure is reached within several days. Developed primarily to cure epoxy resins at room temperature, EPIKURE Curing Agent 3055 can also be used at elevated temperatures. Since elevated temperatures greatly reduce the cure time, the cure schedule should be carefully watched. Except for heat deflection temperature, differences in properties are small, indicating that even though cure may not be complete at room temperature, it is satisfactory for many applications.

EPIKURE 3055 Application Areas/Suggested Uses

• General purpose

EPIKURE 3055 Benefits

• Low viscosity
• Immediate compatibility
• Long working life
• Variable combining ratio

Sales Specifications

Typical Properties

Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.Please refer to the Hexion web site for Shelf Life and recommended Storage information. EPIKURE Curing Agent 3055 should be stored in tightly sealed containers, in a dry location at normal room temperature. Care should be taken to
avoid storage environments resulting in moisture contamination. Exposure to moisture will cause an increase in viscosity and reactivity, the
degree of increase depending on the amount of moisture which has been absorbed. Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

Sizes Available

Available in quart, gallon, 5 gallon, and 55 gallon drum sizes.

Technical Support

Please refer to the TDS for more technical information.

If you require any further technical or application support please contact our technical staff

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