semi-permanent

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semi-permanent

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Composite Mold Release Agent ReleaSys™ 8800.
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Epoxy Mold Release Agents

Composite Mold Release Agent | ReleaSys™ 8800

ReleaSys™ 8800 is a high performance water-based, semi-permanent mold release system developed to yield unmatched durability and surface slip. This formulation is ideal for high performance composite structures and large scale molding operations ReleaSys 8800 excels at releasing parts from complex, intricate mold geometries. ReleaSys 8800 will not interfere with post-production finishing operation. Benefits of this product include:

  • Superior release agent durability
  • Ideal for TPU and Thermoset Plastics
  • Ideal for high complexity molds
  • Highest Slip; Minimized transfer

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ReleaSys 89 is a high performance SMC release agent product for manufacturers
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Epoxy Mold Release Agents

SMC Release Agent | ReleaSys™ 89

ReleaSys 89 is a nonflammable, low odor solvent-based, semi-permanent mold release agent designed to provide superior release and durability to SMC and Composite molders. This formulation is particularly effective on difficult molding applications or abrasive substrates.

  • Ideal for Composites, SMC, and FRP
  • Exceptional release and durability
  • High Slip; Ideal for complex mold geometries
  • Protects mold surface; Zero transfer

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Rubber mold release agents offer superior performance
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PTFE Free Release Agents

Rubber Mold Release Agents | ReleaSys™ 85

ReleaSys 85 is a highly versatile water-based, semi-permanent mold release agent designed to exhibit superior durability, extended release performance, and minimization of slip-stick for all Rubber and Elastomeric compounds.

  • High Release / Zero Transfer
  • Specialized from Rubber/Elastomers
  • Ideal for complex molds
  • Improves quality and consistency of molded parts
  • Minimizes mold build-up and fouling

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Water-based PTFE Release Agent ReleaSys™ 82. PTFE release coating ideal for composites and elastomers
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Silicone Rubber Mold Release Agents

Water-based PTFE Release Agent | ReleaSys™ 82

ReleaSys 82 is an aerosolized water-based, semi-permanent dry film mold release agent designed to provide reliable, consistent release across a broad range of moldable substrates.  Properly applied, our product develops a durable, thin-film on the mold surface with minimal mold build-up.  ReleaSys 82 will not interfere with post-production finishing operation. Benefits of this product include:

  • High durability; Surface activation chemistry
  • Ideal for lower complexity molds
  • Ideal for Rubber to Metal Bonding
  • Improves quality and consistency of molded parts

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PTFE Water-based Release Agents. ReleaSys 8200 water-based release agent with TEFLON
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Epoxy Mold Release Agents

PTFE Water-based Release Agents | ReleaSys™ 8200

Water-based, PTFE Dry Film release agents designed to provide reliable, consistent release across a broad range of moldable substrates. Excels at compression and transfer molding. ReleaSys 8200 will not interfere with post-production finishing operation. Benefits of this product include:

  • Ideal for Rubbers, Elastomers, & Plastics
  • Ideal for Silicone Rubber & LSR
  • 100% Silicone & Wax free
  • Clean, Non-oily, Non-migrating
  • Semi-Permanent Release

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Rubber Molding Release Agent. ReleaSys 8500 Rubber mold release agent.
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PTFE Free Release Agents

Rubber Molding Release Agent | ReleaSys™ 8500

Highly versatile water-based, semi-permanent molding release agent designed to exhibit superior durability and release.  Advanced chemistry provides extended reapplication intervals, ideally suited for high-throughput rubber, fluorocarbon and elastomer molders.

  • Optimized for Difficult Rubber/Elastomer molding
  • Ideal for complexity molds
  • High Release; No transfer
  • Minimizes mold build-up and fouling

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Urethane Mold Release Agent. ReleaSys™ 8900 Mold Release.
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Polyurethane Mold Release Agents

Urethane Mold Release Agent | ReleaSys™ 8900

Solvent-based, non-flammable semi-permanent mold release agent designed to provide superior durability and high slip across a broad range of moldable substrates. This formulation is particularly effective on difficult molding applications or abrasive substrates.

  • Ideal for Complex Mold Geometries
  • Zero build-up and Zero Transfer
  • Instant evaporation and cure time

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