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3200 Series (Aliphatic Amines)
EPIKURE™ Curing Agent 3295, a very low viscosity aliphatic amine adduct, is recommended for curing epoxy resins at room or moderately elevated temperatures. Its reduced vapor pressure, less critical combining ratio, superior electrical properties, and non-fuming characteristics make it safer and more convenient to handle than the aliphatic polyamines such as diethylenetriamine. EPIKURE 3295 is ideally suited for many casting, laminating, and impregnation operations and certain coating applications. It can be diluted with water and is useful as a curing agent for aqueous resin systems. Applications include:
- Brush head potting compounds
- Laminated and cast tooling
- High-build maintenance coatings
- Water-dilutable adhesives
3300 Series (Cyclo-aliphatic Amines)
EPIKURE™ Curing Agent 3370 is a low viscosity, modified cycloaliphatic amine capable of effecting thorough cures in epoxy resin systems at normal room temperature. Applications include industrial and chemical resistane floor toppings, light colored casting, and tank lining application. Benefits include:
- Good overnight cure development
- Moderate resistance to blush or "sweat-out"
- High degree of chemical resistance
- Light color
EPIKURE™ W
EPIKURE™ Curing Agent W system consists of a bisphenol-F epoxy resin and an aromatic amine for fabricating composite parts using resin transfer molding (RTM) or filament winding. EPIKURE Curing Agent W has low viscosity and very long working life at room temperature making this system versatile and easy to process and does not contain methylene dianiline (MDA). Benefits include:
- Low room temperature viscosity (about 2200 cP)
- Long working life (>20 hrs.)
- Low moisture absorption (2-2.5 wt%)
- Good epoxy performance characteristics
- Non-MDA aromatic amine, High elongation
Epoxy Resin Systems
The recommendation made here with and the information set forth with respect to the performance or use of our products are believed, but not warranted to be accurate. The products discussed are sold without warranty, as to fitness or performance, express or implied and upon condition that purchasers shall make their own test to determine [...]
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Solid Epoxy Solutions
EPON™ Resin 1001-X-75 is a 75 percent solids solution of an EPON 1001F type epoxy resin in xylene. Systems based on EPON 1001-X-75 can be formulated to have excellent chemical resistance, corrosion resistance, and low color. This resin is used in formulating various room temperature curing industrial maintenance coatings including clears, primers, masonry surfaces, and gloss and semigloss enamels. Benefits Include:
- Excellent Chemical Resistance
- Excellent Corrosion Resistance
- Room Temperature Curing
Solid Epoxy Resins
EPON™ Resin 1001F is a low molecular weight solid epoxy resin derived from a liquid epoxy resin and bisphenol-A. EPON Resin 1001F is used for its application or end-use advantages in both structural and surface-coating applications as follows:
- Structural applications: Excellent pre-impregnation properties
- Surface coatings: Toughness, Chemical Resistance, and Durability
- Thermosetting acrylic: Adhesion, Toughness, Detergent Resistance
Solid Epoxy Resins
EPON™ Resin 1002F is a solid epoxy resin derived from a liquid epoxy resin and bisphenol-A. This epoxy resin finds application in solution type coatings, as an intermediate in the preparation of epoxy esters, high performance hot melt adhesives, molding powders, and in powder coatings. Benefits include:
- Can be formulated into high performance amine or polyamide cured coatings
- Exhibits unique melt viscosity for hot melt adhesives
- Displays a desirable reactivity, rheology and electrical properties in powder coatings
- This resin will not “block” or sinter even at slightly elevated storage temperatures
- Filtered during manufacture so final product is very clean
Solid Epoxy Resins
EPON™ Resin 1004F is a solid epoxy resin derived from bisphenol-A and epichlorohydrin. These epoxy and hydroxyl groups are usually reacted with vegetable oil acids to prepare epoxy resin esters. Epoxy esters derived from EPON Resin 1004F finds applications as vehicles in appliance primers, automotive primers, and in maintenance coatings. EPON Resin 1004F may be used as a partial replacement for other EPON Resins in amine or polyamide cured epoxy air dry finishes and in phenolic and amino modified epoxy baking systems. Benefits include:
- Contains a specific amount of esterification catalyst to control esterification reactions with vegetable oil acids
- Supplied in very large lots (greater than 100M pounds) with uniform properties
- Provides special solution viscosity and reactivity properties when combined with other EPON Resins in air dry amine or polyamide cured epoxy coatings and in epoxy-phenolic or amino converted baking systems.
Solid Epoxy Resins
EPON™ Resin 1007F is a moderately high molecular weight solid epoxy resin derived from a liquid epoxy resin and bisphenol-A. EPON™ Resin 1007F is used extensively as a vehicle in high performance industrial baking finishes. Benefits include:
- High Molecular Weight Resin
- Outstanding Flexibility and Adhesion
- This product imparts unique melt viscosity characteristics to hot melt adhesives, molding powders, and powder coatings
Epoxy Novolac Resins
EPON™ Resin 1031 is a solid, novolac-free multifunctional epoxy resin. It is most frequently used to improve the properties of cured epoxy resin systems particularly at elevated temperatures. It finds applications in electrical laminates, high performance aerospace composites and adhesives, powder coatings, and molding compounds.
- Low saponifiable chloride content; Low ionic contaminants
- Low melt viscosity
- Optical fluorescence; Strong absorbance of UV light
Epoxy Novolac Resins
EPON™ Resin 164 is a solid multifunctional epichlorohydrin/cresol novolac epoxy resin. It combines the high thermal stability of the novolac backbone with the versatility, reactivity, and chemical resistance of epoxy resins. It is used where improved properties of cured epoxy resin systems are needed, particularly at elevated temperature and where stability of electrical properties under humid conditions are required. It finds application in electrical laminates, molding compounds, high performance aerospace composites, high temperature adhesives, powder coatings, and tooling. Benefits include:
- An average of five reactive epoxide groups per molecule
- Low ionic contaminants; Low saponifiable chloride
- Easily ground into uniform particle size; Stability on storage
- Low melt viscosity
Epoxy Acrylates
EPON™ Resin 8021 is a very low viscosity resin possessing excellent wetting characteristics and rapid reaction rates with aliphatic amine curing agents over a broad temperature range. This combination of properties makes EPON 8021 an excellent choice for use in adhesives for bonding difficult-to-wet substrates, low temperature applied flooring compounds, rapid setting sealing compounds, and pressure injection systems. The excellent wetting characteristics of this resin are readily apparent when applied in bondline thicknesses to metal, plastic, damp concrete, and other difficult-to-wet substances. This property is manifest in exceptionally high bond strength to many materials.
- Low Viscosity Resin, Excellent Wetting Properties
- Rapid Reaction Rates
- Broad Temperature Range Usage
- Exceptionally High Bond Strength
Epoxy Resin Blends
EPON™ Resin 813 is a low viscosity liquid bisphenol-A based epoxy resin diluted with HELOXY™ 62 cresyl glycidyl ether. Benefits include:
- Low viscosity for easy pumping and handling
- Reacts with full range of curing agents at low temperatures
- Produces high-strength, chemically resistant cured films
- Slightly lower odor than butyl glycidyl ether diluted epoxy resins
- Less prone to crystallization than other diluted epoxy resins
Epoxy Resin Blends
EPON™ Resin 8132 is a 100% reactive low viscosity liquid bisphenol-A based epoxy resin diluted with an Alkyl glycidyl ether. This resin is specially designed for applications requiring low viscosity, minimum odor and good color. Benefits Include:
- Low viscosity liquid bisphenol-A based epoxy resin
- Can be cured or cross-linked with a variety of curing agents
- 100% Reactive
- Minimum Odor
Epoxy Resin Blends
EPON Resin 815C is a low viscosity liquid bisphenol A based epoxy resin containing a commercial grade of n-butyl glycidyl ether. EPON Resin 815C is functionally equivalent to EPON Resin 815, and is suitable as a replacement for EPON Resin 815 in most applications. Benefits include:
- Low viscosity, allows for easy pumping and wetting of pigments and fillers
- 100% reactive. Reacts with a full range of curing agents
- Provides minimal reduction of performance properties
Unmodified Liquid Epoxy Resins
EPON™ Resin 825 is a high purity bisphenol A epichlorohydrin liquid epoxy. As a result, the viscosity of this product is lower than standard bisphenol A liquid resins without the use of diluents or modifiers. Resin/curing agent systems based on EPON™ 825 have greater clarity, chemical resistance, higher heat distortion temperature, and lower electrical conductivity than can be obtained with most other standard resins. Benefits include:
- Low viscosity, Low color
- Reacts with a full range of curing agents
- Produces high-strength cured systems resistant to chemical attack
Unmodified Liquid Epoxy Resins
EPON™ Resin 826 is a low viscosity, light colored liquid bisphenol A based epoxy resin. It finds use in a variety of applications (coatings and composites) when crosslinked or hardened with appropriate curing agents. Benefits include:
- Low viscosity, Low color
- Low ionic contamination
- Reacts with a full range of curing agents
- Produces high-strength cured systems resistant to chemical attack
Unmodified Liquid Epoxy Resins
EPON™ Resin 828 is an undiluted clear difunctional bisphenol A/epichlorohydrin derived liquid epoxy resin. When cross-linked or hardened with appropriate curing agents, very good mechanical, adhesive, dielectric and chemical resistance properties are obtained. Because of this versatility, EPON Resin 828 has become a standard epoxy resin used in formulation, fabrication and fusion technology. Benefits include:
- Highly versatile resin
- High solids/low VOC maintenance and marine coatings
- Very good mechanical, adhesive, dielectric and chemical resistance
Modified Liquid Epoxy Resins
EPON™ Resin 8280 has been designed especially for formulating filled compounds for a wide variety of structural applications, including bonding, electrical encapsulating, tooling, flooring and most construction uses. EPON Resin 8280 is a low molecular weight resin with outstanding resistance to pigment and filler settling, which gives greater stability to filled systems. EPON Resin 8280 has superior resistance to foaming under vacuum and has an adjusted, controlled reactivity with amine curing agents, which serves to extend pot Iife and working life characteristics. In addition, viscosity stability —often a problem in anti-settling resins — presents no problem for EPON Resin 8280. Benefits include:
- Low foaming
- High resistance to filler settling
- Controlled reactivity with amine curing agents
Modified Liquid Epoxy Resins
EPON™ Resin 8281 was developed for use in formulating highly filled compounds, particularly those with high levels of silica-type fillers. This resin allows the formulator to compound materials suitable for use in a wide variety of products, including adhesives, electrical encapsulants and molding compounds, tooling compounds, and most construction end uses. Benefits include:
- Excellent resistance to pigment and filler settling
- Low saponifiable chlorine level
- Superior resistance to foaming under vacuum
- Viscosity stability comparable to other conventional liquid EPON Resins
Unmodified Liquid Epoxy Resins
EPON™ Resin 830 is a slightly higher molecular weight BPA liquid epoxy as compared to EPON 828. The resin itself is resistant to crystallization and also in blends with HELOXY™ Modifiers. EPON Resin 830 is somewhat higher in viscosity than EPON Resin 828, although the viscosity is still easily handled. It provides greater reactivity when combined with most curing agents. Benefits include:
- Industrial floor toppings and grouting
- High build glaze, sealer or gel coats
- General purpose casting and encapsulation
- Base resin for dilution with Heloxy Modifiers
Unmodified Liquid Epoxy Resins
EPON™ Resin 834 is a BPA based epoxy resin that is semi-solid at room temperature. Systems using EPON Resin 834 can be formulated to be useful in a variety of high solids and tar modified coatings, high toughness adhesives, laminating, and prepreg molding materials. Because of its higher molecular weight, EPON Resin 834 provides enhanced system reactivity, surface tack and cured resin toughness in comparison to liquid grade BPA epoxies, but reduces elevated temperature performance. Ideally useful in applications requiring extra surface tack, cure speed or toughness but cannot tolerate additives or modifiers. Benefits include:
- May be blended with other epoxy resins.
- Semi-solid at room temperature, pourable at slightly elevated temperatures.
- May be used to produce 10 to 15 mil films with high adhesion.
- Improved toughness, tack and cure speed over unmodified liquid epoxies
Unmodified Liquid Epoxy Resins
EPON™ Resin 862 (Diglycidyl Ether of Bisphenol F) is a low viscosity, liquid epoxy resin manufactured from epichlorohydrin and Bisphenol-F. This resin contains no diluents or modifiers. EPON Resin 862 may be used as the sole epoxy resin or combined with other resins such as EPON Resin 828. When blended with EPON Resin 828, EPON Resin 862 provides a technique to reduce viscosity with no sacrifice in chemical and solvent resistance properties, and the blended resin will exhibit improved crystallization resistance properties when compared to the neat, liquid, Bisphenol-A or Bisphenol-F type resins. When EPON Resin 862 is cross-linked with appropriate curing agents, superior mechanical, adhesive, electrical and chemical resistance properties can be obtained. Benefits include:
- Low viscosity, Low color
- Reacts with a full range of epoxy curatives
- Good chemical resistance
- Superior physical properties vs. diluted (6 Poise) resins
Modified Liquid Epoxy Resins
EPON™ Resin 872 is a chemically modified BPA based epoxy resin that is semi-solid at room temperature. Systems using EPON Resin 872 can be formulated with other EPON Resins, HELOXY™ Modifiers, or used as the sole resin to provide varying degrees of flexibility and toughness. EPON Resin 872 is especially useful in applications requiring extra resistance to thermal shock or impacts. Benefits include:
- May be blended with other epoxy resins
- Semi-solid at room temperature, pourable at mildly elevated temperatures
- May be used to produce potting and encapsulants of high thermal shock resistance
- Improved toughness and flexibility over unmodified liquid epoxies