Epoxy mold release

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Epoxy mold release

- PRODUCT LIST

ReleaSys™ DF is a solvent-based, dryfilm mold release agent designed to provide superior surface adhesion and wear resistance. Miller-Stephenson’s exclusive surface activation technology allows for unmatched durability and maximal releases per application. Utilization of a proprietary fluoropolymer, this non-silicone mold release agent does not transfer and will not contribute to any cross contamination pitfalls typically seen with silicone release agents. ReleaSys™ DF is particularly effective for cold molding operations which require high slip, instant cure, and rapid output. The product is ideally suited for molding epoxies, composites, and thermoplastics. Benefits include:

  • DryFilm Release System
  • No interference will post-molding operations
  • Ideal for Epoxies, Plastics, and Composites
  • Clean, Non-oily, Non-migrating
  • Non-Silicone, Non-wax
 

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ReleaSys EP5 Epoxy release agent is a highly advanced release system designed to provide exceptional release of epoxy composites, adhesives, and injection molded parts.  Utilizing our next-generation fluoropolymer chemistry, we have developed a release coating which provide unmatched utility and performance in all epoxy molding / release operations.  Molded products will exhibit ease of release cycle after cycle without the need for frequent re-application or the need to clean the part off. A truly unrivaled chemistry, ReleaSys EP5 performs in the most demanding epoxy molding and adhesive release operations, providing superior reapplication intervals, consistent part quality, and smooth release in an economical and efficient one-coat system.

  • Miller-Stephenson most advanced DryFilm system
  • Optimized for Epoxy-based systems
  • Exceptional durability with no transfer
  • Rapid Drying and Cure times
  • Minimized VOC and odor

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