EPON™ Resin 8281 was developed for use in formulating highly filled compounds, particularly those with high levels of silica-type fillers. This resin allows the formulator to compound materials suitable for use in a wide variety of products, including adhesives, electrical encapsulants and molding compounds, tooling compounds, and most construction end uses. Benefits include:

• Excellent resistance to pigment and filler settling
• Low saponifiable chlorine level
• Superior resistance to foaming under vacuum
• Viscosity stability comparable to other conventional liquid EPON Resins