EPON™ Resin 872 is a chemically modified BPA based epoxy resin that is semi-solid at room temperature. Systems using EPON Resin 872 can be formulated with other EPON Resins, HELOXY™ Modifiers, or used as the sole resin to provide varying degrees of flexibility and toughness. EPON Resin 872 is especially useful in applications requiring extra resistance to thermal shock or impacts. Benefits include:

• May be blended with other epoxy resins
• Semi-solid at room temperature, pourable at mildly elevated temperatures
• May be used to produce potting and encapsulants of high thermal shock resistance
• Improved toughness and flexibility over unmodified liquid epoxies