EPON™ Resin 8280 has been designed especially for formulating filled compounds for a wide variety of structural applications, including bonding, electrical encapsulating, tooling, flooring and most construction uses. EPON Resin 8280 is a low molecular weight resin with outstanding resistance to pigment and filler settling, which gives greater stability to filled systems. EPON Resin 8280 has superior resistance to foaming under vacuum and has an adjusted, controlled reactivity with amine curing agents, which serves to extend pot Iife and working life characteristics. In addition, viscosity stability —often a problem in anti-settling resins — presents no problem for EPON Resin 8280. Benefits include:

• Low foaming
• High resistance to filler settling
• Controlled reactivity with amine curing agents