Solid Epoxy Resins
EPON™ Resin 1001F is a low molecular weight solid epoxy resin derived from a liquid epoxy resin and bisphenol-A. EPON Resin 1001F is used for its application or end-use advantages in both structural and surface-coating applications as follows:
- Structural applications: Excellent pre-impregnation properties
- Surface coatings: Toughness, Chemical Resistance, and Durability
- Thermosetting acrylic: Adhesion, Toughness, Detergent Resistance
Solid Epoxy Resins
EPON™ Resin 1002F is a solid epoxy resin derived from a liquid epoxy resin and bisphenol-A. This epoxy resin finds application in solution type coatings, as an intermediate in the preparation of epoxy esters, high performance hot melt adhesives, molding powders, and in powder coatings. Benefits include:
- Can be formulated into high performance amine or polyamide cured coatings
- Exhibits unique melt viscosity for hot melt adhesives
- Displays a desirable reactivity, rheology and electrical properties in powder coatings
- This resin will not “block” or sinter even at slightly elevated storage temperatures
- Filtered during manufacture so final product is very clean
Solid Epoxy Resins
EPON™ Resin 1007F is a moderately high molecular weight solid epoxy resin derived from a liquid epoxy resin and bisphenol-A. EPON™ Resin 1007F is used extensively as a vehicle in high performance industrial baking finishes. Benefits include:
- High Molecular Weight Resin
- Outstanding Flexibility and Adhesion
- This product imparts unique melt viscosity characteristics to hot melt adhesives, molding powders, and powder coatings